Adding a process layer breaks a connection or shorts a port

Inspect the whole stack

1. Compare the layer order, mask type and physical function before and after the change.
2. Inspect the generated geometry at vias and terminal contacts, including the layers immediately above and below the new layer.
3. Check whether the new layer blocks a via etch, adds a conductive path or changes the intended resistor contact.
4. Apply ViaBypass or other connectivity controls only when they represent the actual process. Verify the affected and previously working connections in a small model.

Know what ViaBypass does

For the documented conductive mask types, ViaBypass allows a via etch through the isolation above to continue into the isolation below when no conductive object blocks it. It is a process-modelling rule, not a general switch for fixing all open circuits.

Support may supply a process-specific model. Do not transfer another fabrication process's layer parameters into your own stack.